Micron scale tin oxide-based semiconductor devices
US12328906B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 4, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Apr 11, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/3293
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Micron scale tin oxide-based semiconductor devices are provided. Reactive-ion etching is used to produce a micron-scale electronic device using semiconductor films with tin oxides, such as barium stannate (BaSnO3). The electronic devices produced with this approach have high mobility, drain current, and on-off ratio without adversely affecting qualities of the tin oxide semiconductor, such as resistivity, electron or hole mobility, and surface roughness. In this manner, electronic devices, such as field-effect transistors (e.g., thin-film transistors (TFTs)), are produced having micron scale channel lengths and exhibiting complete depletion at room temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.