Flexible printed circuit board device for interfacing high density ultrasound matrix array transducer with integrated circuits
US12329576B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2020 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Feb 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed circuit board includes a central portion and one or more tabs extending from the central portion. The one or more tabs are foldable relative to the central portion. A plurality of pads are located within the central portion, and the plurality of pads are configured to electrically connect to a transducer. Lands are located within one of the one or more tabs, and electrical traces connect the plurality of pads and the lands. A method of manufacturing an electronics assembly includes providing a flexible printed circuit board with a plurality of central portions and folding the substrate such that the adjacent central portions are vertically stacked and the pads of adjacent central portions are electrically connected. Prior to folding the substrate, a transducer may be affixed to the plurality of pads and one or more electrical components may be affixed to the lands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.