Anatomically contoured stimulation leads for high density neural interface
US12329963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2020 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jul 14, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/0534
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to anatomically contoured spinal cord stimulation leads for high density neural interfaces and methods of microfabricating the stimulation leads. Particularly, aspects are directed to a thin film lead assembly that includes a cable having: a first supporting structure formed of dielectric material, a first set of conductive traces formed on the first supporting structure, a second supporting structure formed of dielectric material, and a second set of conductive traces formed on the second supporting structure. The thin film lead assembly also includes an electrode assembly having: a third supporting structure formed of dielectric material, a first set of electrodes in electrical connection with the first set of conductive traces, and a second set of electrodes in electrical connection with the second set of conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.