Method and apparatus for edge finishing of high mechanical strength thin glass substrates

US12330267B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Jonas Bankaitis · Horseheads, US
• Duc Anh Bui · Krailling, DE
• Scott Steven Cronk · Webster, US
• Christopher Paul Daigler · Corning, US
• Christina Marie Laskowski · Riverside, US
• Neil Eugene Partridge · Avoca, US
• Uwe Stute · Wunstorf, DE
• Sergio Tsuda · Horseheads, US
• Chad Michael Wilcox · Horseheads, US

Key dates

• Filing date: Jun 11, 2020
• Grant date: Jun 17, 2025
• Expiry date: Nov 6, 2041

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B29/005
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.