Curable siloxane resin composition
US12331164B2 · kind B2 · utility
0Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Feb 10, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a curable siloxane composition with low dielectric constant and low dielectric loss, in which organic alkoxy silane having a silicon-based asymmetric structure and organic alkoxy silane having a silicon-based symmetric structure are included. The curable siloxane composition has low dielectric constant and dielectric loss in a high frequency range, low water absorption, excellent workability, and high copper foil peel strength, and thus physical properties suitable for application to printed circuit boards for high-frequency communication electronic devices may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.