Silicone adhesive composition and methods for its preparation and use for electronic device fabrication
US12331229B2 · kind B2 · utility
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15References
15Claims
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Key dates
| Filing date | Mar 24, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Aug 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A UV curable silicone adhesive composition and method for its preparation are provided. The UV curable silicone adhesive composition is useful in electronic device fabrication for adhering components such as fingerprint sensors to substrates, such as OLED display devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.