Magnetic sensor package and magnetic sensing system
US12332089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2023 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Aug 18, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic sensor package comprising a magnetic multi-turn sensor die and a magnetic single turn sensor die, in which both sensor dies are packaged on the same lead frame. A method of manufacturing the magnetic sensor package is also provided. A magnetic sensor system comprising a rotating magnet and the magnetic sensor package, where the sensor package is arranged so that both sensor dies sit within a homogenous magnetic field, thereby ensuring that the output signal of each sensor is not corrupted by any stray fields.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.