Molding apparatus for molding composition on substrate using mold, molding method, and method for manufacturing article
US12332562B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jul 22, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A molding apparatus for molding a composition on a substrate using a mold includes a conveying unit configured to convey an object, a holding unit configured to hold the object conveyed by the conveying unit, a supply unit configured to supply gas to an object space surrounding the object held by the holding unit, and a control unit configured to control the supply unit so that a first amount of supply per unit time of the gas to be supplied from the supply unit in a case where the conveying unit is inside the object space is different from a second amount of supply per unit time of the gas to be supplied from the supply unit in a case where the conveying unit is outside the object space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.