Patent · US Active

Powder flow measurement in additive manufacturing systems

US12333737B2 · kind B2 · utility

0Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 16, 2022
Grant dateJun 17, 2025
Priority date
Expiry dateMay 25, 2043

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A powder flow monitoring system may include a computing device configured to receive image data representing illuminated powder of a powder stream between a powder delivery device and a build surface of a component, generate a representation of the powder stream based on the image data, and output the representation of the powder stream for display at a display device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.