Conductive paste and multilayer electronic component
US12334260B2 · kind B2 · utility
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Key dates
| Filing date | Dec 1, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jul 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1209
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive paste includes: conductive powder containing Cu particles; and a glass frit including an oxide containing alkali metal, wherein a content of the alkali metal is 0.16 wt % or more and 0.35 wt % or less with respect to a total content of the Cu particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.