Plasma source and method for removing materials from substrates utilizing pressure waves
US12334301B2 · kind B2 · utility
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Key dates
| Filing date | Oct 26, 2023 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Oct 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/2487
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.