Liquid delivering system for wafer cleaning equipment
US12334368B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 16, 2025 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jan 16, 2045 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A liquid delivering system for wafer cleaning equipment includes an acid scouring tank, a sulfuric acid supplying source, a hydrogen peroxide supplying source, a first mixing device, a second mixing device and a feedback-control panel. The first mixing device and the second mixing device both includes a mixing duct, a multi-section mixing screw rod arranged inside the mixing duct and a heater wrapped around the mixing duct. By ways of adopting the above-mentioned technical solution, it is possible to realize fully mixing sulfuric acid with hydrogen peroxide in a mode of mixing in multi-stages, achieve precise control to temperature, and enable mixed liquid to fully react, thereby ensuring that the mixed liquid coming into the acid scouring tank meets cleaning requirements, and improving quality and efficiency of cleaning wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.