Semiconductor package
US12334411B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jul 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a substrate body made of an insulating material and having a frame shape with a through hole; and a heat-dissipating member made of a metallic material and having a top face serving as an element-mounting surface, the element-mounting surface being positioned in the through hole. A back face of the substrate body and a front face of the heat-dissipating member are joined to each other with a joining agent, the back face being oriented downward, the front face being oriented upward. The substrate body includes a first riser portion extending downward from the back face. The heat-dissipating member includes a second riser portion extending upward from the front face. The joining agent is placed in a space enclosed by the back face, the first riser portion, the front face, and the second riser portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.