Systems and methods for active and passive cooling of electrical components
US12334852B2 · kind B2 · utility
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112References
18Claims
0Family size
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Key dates
| Filing date | Jan 31, 2023 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Nov 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/018
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.