High-frequency module and communication device
US12336086B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2023 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jul 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6655
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface of the resin member, and a metallic shield plate arranged on the main surface and between the circuit component and the circuit component when the main surface is viewed in a plan view. The metallic shield plate is in contact with the metallic shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member. At least a part of the engraved mark portion is provided in a portion in which the resin member and the metallic shield plate overlap each other when the main surface is viewed in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.