Card substrate for carrying chip module and smart card thereof
US12336101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2023 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Nov 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09036
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a card substrate for carrying a chip module, the card substrate has a first surface and a second surface opposite to the first surface, and a concave portion for accommodating the chip module, the concave portion includes a first concave portion, and a second concave portion further recessed from a bottom wall of the first concave portion, in a left-right direction, a size of the second concave portion gradually narrows from a middle to both sides, and in an up-down direction, the size of the second concave portion gradually narrows from the middle to both sides. The card substrate of the invention can provide good support and protect for the chip module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.