Method of printed circuit board dielectric molding or machining and electrolytic metallization
US12336113B2 · kind B2 · utility
0Cited by
17References
8Claims
0Family size
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Key dates
| Filing date | Mar 27, 2024 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Mar 27, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K15/08
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for making a printed circuit board (PCB) with a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.