Server device and cooling apparatus
US12336139B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 14, 2023 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Feb 29, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A server device includes a casing, a flow equalizing plate and a server. The casing has an accommodating space, a liquid inlet and a liquid outlet. The accommodating space accommodates a cooling liquid. The accommodating space is in fluid communication with the liquid inlet and the liquid outlet. The flow equalizing plate is detachably located in the accommodating space. The flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace. The flow equalizing plate has through holes. The through holes are in fluid communication with the upper subspace and the lower subspace. The liquid inlet is in fluid communication with the lower subspace. The liquid outlet is in fluid communication with the upper subspace. The server is located in the upper subspace. The liquid inlet and the liquid outlet are in fluid communication with the server. Sizes of the through holes are different.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.