Systems and methods for three-dimensional vapor chambers in immersion-cooled datacenters
US12336143B2 · kind B2 · utility
0Cited by
5References
20Claims
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Key dates
| Filing date | Nov 24, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Dec 16, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0029
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A vapor chamber includes a main body, a first vertical structure, and an enhanced boiling surface. The main body has a first surface and defines a first portion of an interior volume. The first vertical structure protrudes transverse to the main body and defines a second portion of the interior volume. The enhanced boiling surface is on at least a portion of the first vertical structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.