Driving backplane, manufacturing method thereof, and light-emitting substrate
US12336353B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 16, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Apr 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A driving backplane, a manufacturing method thereof, a light-emitting substrate are provided. In the driving backplane, a first conductive layer on a substrate; a first organic film layer is between the first conductive layer and second conductive layer, the first organic film layer has first via holes; a first inorganic film layer is on one side of first organic film layer away from the substrate; the second conductive layer is on one side of first inorganic film layer away from first organic film layer, the second conductive layer and the first conductive layer are connected through the first via holes; orthographic projections of the first conductive layer and second conductive layer have an overlapping region, the overlapping region includes a region including orthographic projection of the first via holes, and a first region, an orthographic projection of the first inorganic film layer covers parts of the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.