Device and method for treating the surface of molded parts
US12337557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2024 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 1, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2377/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method is provided for treating a surface of a molded part produced in a 3D printing method. In the method, the molded part is introduced into a pressure-tight container, negative pressure, preferably a vacuum to a large extent, is generated in the container after introducing the molded part, a solvent is heated up to a specified solvent temperature, and the heated solvent is introduced from a solvent container into the container under negative pressure. In such a method, the temperature of the molded part is lower than the solvent temperature, and the solvent is evaporated or is introduced as a vapor upon being introduced, the solvent vapor condensing on the surface of the molded part. Also provided is a device for carrying out the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.