Patent · US Active

Device and method for treating the surface of molded parts

US12337557B2 · kind B2 · utility

0Cited by
2References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 1, 2024
Grant dateJun 24, 2025
Priority date
Expiry dateMar 1, 2044

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08J2377/02
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method is provided for treating a surface of a molded part produced in a 3D printing method. In the method, the molded part is introduced into a pressure-tight container, negative pressure, preferably a vacuum to a large extent, is generated in the container after introducing the molded part, a solvent is heated up to a specified solvent temperature, and the heated solvent is introduced from a solvent container into the container under negative pressure. In such a method, the temperature of the molded part is lower than the solvent temperature, and the solvent is evaporated or is introduced as a vapor upon being introduced, the solvent vapor condensing on the surface of the molded part. Also provided is a device for carrying out the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.