Mold segment with connected first and second sipe elements for use in forming a tire
US12337564B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2019 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 13, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D2030/0613
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold segment for forming a tire is provided that has a first sipe element with a protrusion that extends from a first sipe element side surface. The height of the protrusion is less than a height of the first sipe element side surface. A second sipe element is present and has a cavity that extends from a second sipe element side surface. The cavity has a height that is less than a height of the second sipe element side surface. A mold segment base is included that receives the first sipe element and the second sipe element. The cavity receives the protrusion such that the protrusion is located in the cavity and so that the first sipe element side surface directly faces the second sipe element side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.