Hot melt adhesive composition having improved wet bonding strength
US12338375B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2021 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jan 6, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a hot melt adhesive composition comprising a polymer component, the polymer component comprising at least one styrene-butadiene-styrene block copolymer P having a styrene content from 35 to 50% by weight: a styrene-butadiene diblock content from 50 to 80% by weight; and a viscosity of a 15% by weight toluene solution at 25° C. of 20 to 40 mPa·s, and at least one styrene block copolymer other than a styrene-butadiene-styrene block copolymer, wherein said styrene-butadiene-styrene block copolymer P is at a content from 10 to 40% by weight relative to the total weight of the polymer component. The invention also relates to the use of said composition as an adhesive for bonding two substrates, and to articles comprising at least one interior or exterior surface coated with said composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.