Force sensor with target on semiconductor package
US12339159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 9, 2043 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA47J42/44
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A force sensor has a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece includes the target, and it is attached to the semiconductor package. The attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.