Probe card and method for repairing probe card
US12339314B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2021 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jun 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The purpose of the present invention is to provide a method for repairing a probe card in which a defect has occurred in an alignment symbol or a peripheral region thereof by using a high reflection chip for alignment. The present invention is provided with a probe 16 for contacting an inspection object, a wiring substrate 14 to which the probe 16 is attached, and a high reflection chip 4 for alignment provided to a probe installation surface 17 of the wiring substrate 14. The high reflection chip 4 includes a metal plate having a fixing through-hole 41, and has an affixing surface to be attached to the probe installation surface 17 with an adhesive 6 and a mirror-finished high reflection surface on the other side from the affixing surface. The adhesive 6 formed on the affixing surface has a ridge 61 that extends into the fixing through-hole 41.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.