Patent · US Active

Method for producing a chip card body

US12340265B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

GIESECKE+DEVRIENT EPAYMENTS GMBH · DE

Inventors

Thorsten Sauer · Erding, DE
Michael Baldischweiler · Munich, DE
Thomas Tarantino · Laufen, DE

Key dates

Filing date	Jun 24, 2022
Grant date	Jun 24, 2025
Priority date	—
Expiry date	Jul 4, 2042

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/07771
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method is provided for producing a chip card body having a metallic core layer for a contactless or dual-interface chip card. A slot in the metallic core layer for reducing eddy currents is generated not in the metallic multiple-copy sheet itself but instead only in the metallic core layer extracted from the metallic multiple-copy sheet. In this way, there are no short-circuit-forming metal chips left in the slot, since the slot is generated only after the extraction of the metallic core layer from the multiple-copy sheet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.