Chip resistor and method of producing thereof
US12340925B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2023 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 1, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/281
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip resistor 10 comprises: a insulating substrate 1; a pair of upper surface electrodes 2; a resistor 3; a pair of lower surface electrodes 5; a pair of resin electrode layers 6 made of synthetic resin materials containing conductive particles and laminated on the pair of lower surface electrodes 5; a pair of end face electrodes 7; and a pair of external electrodes 8, wherein the pair of the lower surface electrodes 5 is made of metal thin film layers formed as thin films on a mounting surface of the insulating substrate 1, respectively, and includes exposed portions 5a exposed from the resin electrode layers 6, respectively, and the pair of external electrodes 8 is in contact with the exposed portions 5a of the lower surface electrodes 5 and entire surfaces of the resin electrode layers 6, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.