Multilayer electronic component
US12340944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jan 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/2325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component, includes: a body including a stack portion having a dielectric layer and an internal electrode disposed in a first direction, a connection electrode disposed on an end surface of the stack portion in a second direction, to be connected to the internal electrode, and an insulating layer covering the connection electrode, the body having opposing first and second surfaces in the first direction, opposing third and fourth surfaces in the second direction, and opposing fifth and sixth surfaces in a third direction; and an external electrode connected to the connection electrode. The connection electrode includes a body portion in contact with one end of the internal electrode in the second direction, and one or more of first lead portions extending from the body portion to be in contact with one or more of the first surface, the second surface, the fifth surface, and the sixth surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.