Systems and methods for cooling electronic circuits
US12341075B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2024 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Dec 3, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32245
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Examples of devices for providing cooling solutions are described. One example device includes a boilerplate, a printed circuit board (PCB), one or more integrated circuit (IC) chips placed on the PCB, a thermal interface material (TIM), and one or more gaskets. The TIM is placed between the boilerplate and at least one IC chip of the one or more IC chips. The TIM is coupled to a surface of at least the IC chip that faces the boilerplate. The one or more gaskets are placed between the boilerplate and the PCB and encompassing the TIM. The one or more gaskets are configured to seal the at least one IC chip to provide a protective barrier for the TIM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.