Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling
US12341114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2021 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Oct 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die-level interposer having a first surface and an opposing second surface; a first die coupled to the first surface of the die-level interposer by a first hybrid bonding region having a first pitch; a second die coupled to the second surface of the die-level interposer by a second hybrid bonding region having a second pitch different from the first pitch; and a third die coupled to the second surface of the die-level interposer by a third hybrid bonding region having a third pitch different from the first and second pitches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.