Patent · US Active

Dual die integrated circuit system in an integrated circuit package with two separate supply domains

US12341138B2 · kind B2 · utility

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15Claims

0Family size

Assignee

TDK—Micronas GmbH · DE

Inventors

Paolo Marozzi · Freiburg (Elbe), DE
Ingo Freund · Endingen am Kaiserstuhl, DE

Key dates

Filing date	Sep 29, 2022
Grant date	Jun 24, 2025
Priority date	—
Expiry date	Jan 26, 2044

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A dual die integrated circuit (IC) system (1) in an integrated circuit (IC) package (11) with two separate supply domains is provided comprising a first die (20); a second die (30); a lead frame (60) having a first ground pin (GND1), a first supply voltage (Vsup1), a second ground pin (GND2), and a second supply voltage (Vsup2), wherein the first die (20) is connected to the first ground pin (GND1) and to the first supply voltage (Vsup1) and wherein the second die (30) is connected to the second ground pin (GND2) and to the second supply voltage (Vsup2); and at least one capacitive element (70) coupled between the first ground pin (GND1) and the second ground pin (GND2) and coupled between the first supply voltage (Vsup1) and the second supply voltage (Vsup2).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.