Electronic device and manufacturing method of electronic device
US12341142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Sep 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/129
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are an electronic device and a manufacturing method of an electronic device. The manufacturing method includes the following. A first substrate is provided. The first substrate includes a plurality of chips. A second substrate is provided. A transfer process is performed to sequentially transfer a first chip and a second chip among the chips to the second substrate. The second chip is adjacent to the first chip. A first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate. A second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate. The first angle is different from the second angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.