Device substrate and manufacturing method thereof
US12341143B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jul 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device substrate, including a circuit substrate, a first side wiring, a sealant structure, and a second side wiring, is provided. The first side wiring extends from a first surface of the circuit substrate to a second surface of the circuit substrate along a side surface of the circuit substrate. The sealant structure is located above the first surface and covers the first side wiring on the first surface. The second side wiring extends from the sealant structure to the first side wiring located on the side surface and the second surface of the circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.