Method for forming conductive pattern and display device including conductive pattern
US12341145B2 · kind B2 · utility
0Cited by
7References
9Claims
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Key dates
| Filing date | Jul 29, 2020 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Nov 29, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136295
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A conductive pattern forming method according to an embodiment includes: forming a first conductive pattern on a substrate; sequentially forming a release layer and a conductive layer on a transfer substrate that includes a mask; irradiating intense pulsed light (IPL) to the substrate where the first conductive pattern is formed; placing the transfer substrate on the substrate; transferring a portion of the conductive layer, corresponding to an opening of the mask, onto the substrate by irradiating the IPL to the transfer substrate to form a second conductive pattern on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.