Packaging structure and power amplifier
US12341480B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Dec 31, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0061
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component is disposed on the metal plate. The first component is connected to the printed circuit board, the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.