Surface-acoustic-wave (SAW) filter with a compensation layer having multiple densities
US12341489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2021 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 24, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/64
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An apparatus is disclosed for a surface-acoustic-wave filter with a compensation layer having multiple densities. In an example aspect, the apparatus includes at least one surface-acoustic-wave filter with a piezoelectric layer, a substrate layer, and a compensation layer positioned between the piezoelectric layer and the substrate layer. The compensation layer includes a first portion having a first density and a second portion having a second density. The second density is greater than the first density. The first portion is positioned closer to the piezoelectric layer as compared to the second portion. The second portion is positioned closer to the substrate layer as compared to the first portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.