Microphone apparatus
US12342113B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2021 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/15
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone apparatus including: a casing; a composite material located within the casing, the composite material including at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted by an acoustic wave, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.