Wiring board and method of producing wiring board
US12342473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2023 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jan 5, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1338
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board capable of suppressing migration between wires and to provide a method of producing the same, in a method of producing a wiring board provided with a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board is formed by performing steps of forming a first insulating resin layer provided with a wiring pattern and openings, forming a first inorganic insulating film on the first insulating resin layer, forming a first conductor layer corresponding to the wiring pattern and the openings on the inorganic insulating film, and forming a second inorganic insulating film on the first conductor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.