Electromagnetic interference shielding structures
US12342515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2023 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Sep 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0081
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The instant disclosure relates to EMI shielding structures. A conductive composition is formed that includes a polymer and graphene present as a 3D-matrix therein. Rectangular EMI shielding panels are formed using the composition. Rectangular EMI shielding panels are affixed orthogonal to each other. The EMI shielding panels are successively overlapped to form a plurality of interconnected EMI shielding planes. The EMI shielding panels are affixed to each other to form a helical EMI shielding structure that folds and unfolds along its center axis. The EMI shielding planes are angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer. The EMI shielding planes rotate about the center axis when the HES structure transitions between the folded and unfolded states.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.