LED module
US12342667B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Mar 17, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Aug 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/85
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.