Embedded thermoelectric cooler using thermally anisotropic mesas for power device heat generating source temperature reduction
US12342719B2 · kind B2 · utility
0Cited by
2References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jun 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device including a substrate having a semiconductor material containing an embedded thermoelectric cooler with thermally anisotropic mesas between the cold terminal and the hot terminal of the embedded thermoelectric cooler adjacent to a heat source; the adjacent embedded thermoelectric cooler providing a temperature reduction for the heat source resulting in increased safe operating area (SOA) for the microelectronic device. The thermally anisotropic mesas are formed in parallel with deep trenches used as isolation in the microelectronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.