Patent · US Active

Device and method for embossing a component

US12343926B2 · kind B2 · utility

0Cited by

0References

18Claims

0Family size

Assignee

Mahle International GmbH · DE

Inventors

Klaus Hassdenteufel · Gerlingen, DE
Stefan Schill · Renningen, DE
Daniel Schleicher · Esslingen am Neckar, DE

Key dates

Filing date	Jul 13, 2023
Grant date	Jul 1, 2025
Priority date	—
Expiry date	Jul 13, 2043

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/18
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A device, e.g., a heat exchanger, is disclosed. The device includes a first component and a second component. The first component has at least a first surface portion and a second surface portion. The first surface portion and the second surface portion are located opposite to one another and are spaced apart from one another. The first component includes a first support groove provided at the first surface portion and a functional groove provided at the first surface portion. The functional groove is arranged spaced apart from the first support groove at least in some sections. The functional groove is structured and arranged for partially receiving a second component for a substance-to-substance bond.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.