Process for forming a laminate
US12343968B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2019 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Oct 20, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides a process for forming a laminate. The process includes (A) uniformly applying an isocyanate component to a first substrate, the isocyanate component containing an isocyanate compound; (B) uniformly applying an isocyanate-reactive component to a second substrate, the isocyanate-reactive component containing an amine-terminated compound; (C) bringing the first substrate and the second substrate together, thereby mixing and reacting the isocyanate component and the isocyanate-reactive component to form an adhesive composition between the first substrate and the second substrate; (D) curing the adhesive composition to bond the first substrate and the second substrate; and (E) forming the laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.