High temperature RF surface aperture
US12344406B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Jul 5, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64D47/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio frequency surface-aperture, including: a mechanical support structure configured for maintaining mechanical stiffness and strength at a selected temperature; thermal insulation having at least a single layer; one or more through-thickness waveguides located through a thickness of the mechanical support structure and thermal insulation; a cold-side mode coupler arranged to connect a designated cold side of the one or more through-thickness waveguides to an electronic subsystem device; and one or more surface-wave waveguides arranged as an RF antenna on a surface of the mechanical support structure in operative communication with the through-thickness waveguides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.