Patent · US Active

Polycrystalline diamond compact cutting elements, earth-boring tools including such cutting elements, and related methods of making and using same

US12344558B2 · kind B2 · utility

0Cited by
3References
13Claims
0Family size

Inventors

Key dates

Filing dateAug 2, 2022
Grant dateJul 1, 2025
Priority date
Expiry dateJan 19, 2043

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2237/61
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Methods of forming a cutting element include sintering diamond particles at a temperature of at least about 1400° C. under a pressure of at least about 10 GPa in the absence of a metal solvent catalyst so as to form a polycrystalline diamond compact (PDC), providing a barrier material over at least a portion of the PDC, providing a carbide material and a metal binder comprising at least one transition metal element over the barrier material and the PDC, and performing a second sintering process comprising sintering the carbide material, the metal binder, the barrier material, and the PDC at a temperature of at least about 1400° C. under a pressure of at least about 5 GPa to form the cutting element. At least a portion of the PDC proximate an exposed exterior surface of the PDC may be at least substantially free of the metal binder.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.