Cold plate and method of manufacturing cold plate
US12345481B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2024 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Jul 23, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a cold plate that can improve cooling efficiency and simultaneously suppress an increase in size in the thickness direction. A heat-transfer-medium flow space 2 is formed between a heat dissipation surface of a base plate and a cover plate, the base plate has a plurality of heat transfer portions 14 that are provided so as protrude from the heat dissipation surface toward the cover plate 20 and that transfer, to a heat-transfer medium flowing through the heat-transfer-medium flow space 2, heat released from the heat dissipation surface, and concave portions 22, into which at least a portion of tips of the plurality of heat transfer portions 14 are inserted, are formed in a surface of the cover plate facing the heat-transfer-medium flow space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.