Sensor and heat exchanger
US12345548B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2021 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Dec 17, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D1/05366
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A sensor includes a housing, a circuit board, and a sensor chip fixed on the circuit board. The housing defines a receiving cavity and a first channel extending through the housing. The first channel communicates with the receiving cavity and an outside of the sensor. The circuit board is at least partially received in the receiving cavity. At least a part of the circuit board is bonded and fixed to the housing by a thermal conductive glue. The sensor chip is adapted for sensing at least one of a humidity signal and a temperature signal of an environment in the receiving cavity. As a result, the monitoring accuracy is relatively improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.