Metallized optical fiber array module and fabrication method thereof
US12345923B2 · kind B2 · utility
0Cited by
21References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Mar 18, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.