Method of manufacturing a master for a replication process
US12346024B2 · kind B2 · utility
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5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2020 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Dec 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70466
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing a master for use in a wafer-scale replication process is disclosed. The method comprises at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer. The method also comprises a step of developing the at least one patterned layer to provide one or more structures defining the master. In an embodiment, the at least one step of forming the layer of photoresist comprises a process of dry film lamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.