Thermal diode and thermal switch bi-directional heat transfer in building envelopes
US12346136B2 · kind B2 · utility
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18References
10Claims
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Key dates
| Filing date | Apr 29, 2024 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Apr 29, 2044 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/008
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and/or out of a building.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.